IEC 62258-1-2005 半导体压模产品.第1部分:采购和使用的要求
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【英文标准名称】:Semiconductordieproducts-Part1:Requirementsforprocurementanduse
【原文标准名称】:半导体压模产品.第1部分:采购和使用的要求
【标准号】:IEC62258-1-2005
【标准状态】:作废
【国别】:国际
【发布日期】:2005-08
【实施或试行日期】:
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC/TC47
【标准类型】:()
【标准水平】:()
【中文主题词】:定义;规范(验收);电气工程;连接;集成电路;材料;电子工程;芯片;组装件;采办;元部件;试验;交付;薄片;半导体;电子设备及元件;半导体器件;机械试验;生产;电学测量;环境试验
【英文主题词】:Assemblies;Chips;Components;Connections;Definitions;Delivery;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Environmentaltesting;Integratedcircuits;Materials;Mechanicaltesting;Procurements;Production;Semiconductordevices;Semiconductors;Specification(approval);Testing;Wafers
【摘要】:ThispartofIEC62258hasbeendevelopedtofacilitatetheproduction,supplyanduseofsemiconductordieproducts,including-wafers,-singulatedbaredie,-dieandwaferswithattachedconnectionstructures,-minimallyorpartiallyencapsulateddieandwafers.Thisstandarddefinestheminimumrequirementsforthedatawhichareneededtodescribesuchdieproductsandisintendedasanaidinthedesignofandprocurementofassembliesincorporatingdieproducts.Itcoverstherequirementsfordata,including-productidentity,-productdata,-diemechanicalinformation,-test,quality,assemblyandreliabilityinformation,-handling,shippingandstorageinformation.Thisstandardcoversthespecificrequirementsfordataneededtodescribethegeometricalpropertiesofdie,theirphysicalpropertiesandthemeansofconnectionnecessaryfortheiruseinthedevelopmentandmanufactureofproducts.Italsocontains,inAnnexesAandB,terminologyandalistofcommonacronyms,respectively.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:46P;A4
【正文语种】:英语
【原文标准名称】:半导体压模产品.第1部分:采购和使用的要求
【标准号】:IEC62258-1-2005
【标准状态】:作废
【国别】:国际
【发布日期】:2005-08
【实施或试行日期】:
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC/TC47
【标准类型】:()
【标准水平】:()
【中文主题词】:定义;规范(验收);电气工程;连接;集成电路;材料;电子工程;芯片;组装件;采办;元部件;试验;交付;薄片;半导体;电子设备及元件;半导体器件;机械试验;生产;电学测量;环境试验
【英文主题词】:Assemblies;Chips;Components;Connections;Definitions;Delivery;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Environmentaltesting;Integratedcircuits;Materials;Mechanicaltesting;Procurements;Production;Semiconductordevices;Semiconductors;Specification(approval);Testing;Wafers
【摘要】:ThispartofIEC62258hasbeendevelopedtofacilitatetheproduction,supplyanduseofsemiconductordieproducts,including-wafers,-singulatedbaredie,-dieandwaferswithattachedconnectionstructures,-minimallyorpartiallyencapsulateddieandwafers.Thisstandarddefinestheminimumrequirementsforthedatawhichareneededtodescribesuchdieproductsandisintendedasanaidinthedesignofandprocurementofassembliesincorporatingdieproducts.Itcoverstherequirementsfordata,including-productidentity,-productdata,-diemechanicalinformation,-test,quality,assemblyandreliabilityinformation,-handling,shippingandstorageinformation.Thisstandardcoversthespecificrequirementsfordataneededtodescribethegeometricalpropertiesofdie,theirphysicalpropertiesandthemeansofconnectionnecessaryfortheiruseinthedevelopmentandmanufactureofproducts.Italsocontains,inAnnexesAandB,terminologyandalistofcommonacronyms,respectively.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:46P;A4
【正文语种】:英语
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