BS EN 60068-2-69-2007 环境测试.试验.试验Te:用润湿平衡法对表面安装设备(SMD)电子元件的软钎焊性试验

作者:标准资料网 时间:2024-05-03 05:05:26  浏览:8732   来源:标准资料网

【英文标准名称】:Environmentaltesting-Tests-TestTe-Solderabilitytestingofelectroniccomponentsforsurfacemountingdevices(SMD)bythewettingbalancemethod
【原文标准名称】:环境测试.试验.试验Te:用润湿平衡法对表面安装设备(SMD)电子元件的软钎焊性试验
【标准号】:BSEN60068-2-69-2007
【标准状态】:现行
【国别】:英国
【发布日期】:2007-07-31
【实施或试行日期】:2007-07-31
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:组件;电气工程;电学;电子工程;电子设备;电子设备及元件;电工产品;环境测试;材料测试;方法;表面安装设备;软钎焊性;软钎焊性试验;表面安装;表面安装装置;试验设备;测试;润湿平衡
【英文主题词】:Components;Electricalengineering;Electricity;Electronicengineering;Electronicequipment;Electronicequipmentandcomponents;Electrotechnicalproducts;Environmentaltesting;Materialstesting;Methods;SMD;Solderability;Solderabilitytesting;Surfacemounting;Surfacemountingdevices;Testequipment;Testing;Wettingbalances
【摘要】:ThispartofIEC60068outlinestestTe,solderbathwettingbalancemethodandsolderglobulewettingbalancemethod,applicableforsurfacemountingdevices.Thesemethodsdeterminequantitativelythesolderabilityofterminationsonsurfacemountingdevices.IEC60068-2-54isalsoavailableforsurfacemountingdevicesandshouldbeconsultedifapplicable.Theproceduresdescribethesolderbathwettingbalancemethodandthesolderglobulewettingbalancemethodandarebothapplicabletocomponentswithmetallicterminationsandmetallizedsolderpads.Thisstandardprovidesthestandardproceduresforsolderalloyscontaininglead(Pb)andforlead-freesolderalloys.
【中国标准分类号】:L04
【国际标准分类号】:19_040
【页数】:28P.;A4
【正文语种】:英语